光强度对双固化树脂黏接剂与牙本质黏接强度的影响

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Abstract Objective To evaluate the intensity of irradiation after penetrating dentin, and compare the effects of cure-light on the micro-tensile bond strength (mTBS) of dual-cure dental adhesive.Methods The superficial dentin of occlusal surface (40 molars) were exposed and applied with Clearfil DC Bond(A ) or Clearfil SE Bond (B), then bonded together through light-cure from mesial dejection. The bond specimens were cut into sticks(bonding area 1 mm×1 mm) along the direction of light-cure (L_1-5) , and tested with Micro-Tensile Tester for mTBS. The statistical analysis was performed using SPSS11.0.Results After penetrating dentin of 1 mm and 2 mm thickness, the light irradiation decreased to (114±28) mWcm^-2 and (28±11)mWcm^-2, respectively. Some stick samples were broken during preparation, and the fracture occurred at the bonding interface. The remaining samples were SE: L₁ 70%, L₂ 30%, L₃-L₅ 0%; DC: L₁ to L₅ was 68%, 86%, 56%, 44%,38% . The mTBS were (13.22±8.64) MPa (L₁), (7.49±3.88) MPa (L₂) and 0 MPa (L₃ and L₄) for SE,(11.25±4.11) MPa (L₁), (9.69±5.07) MPa (L₂), (8.13±4.88) MPa (L₃), (6.83±3.53) MPa (L₄) and (5.56±2.95) MPa for DC. There was no significant difference between DC and SE regarding the mTBS of L₁ and L₂.Conclusions The mTBS of dual-cureresin adhesive decreased with the increase of cure-light penetrating depth of dentin.

Key words： irradiation intensity dual-cure resin adhesive bond strength

Received: 15 February 2016

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http://journal08.magtechjournal.com/Jwk_wjyx/EN/ OR http://journal08.magtechjournal.com/Jwk_wjyx/EN/Y2016/V27/I6/574

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