Abstract: With the rapid development of China's competitiveness in science and technology (S&T) innovation in recent years, the United States has embarked on a campaign of suppression and blockade against China in high-tech fields, such as chips, 5G, and supercomputing. Existing studies lack systematic analyses about the background and mechanism of U.S. S&T strategy against China. Based on the major events in the field of S&T in the U.S.-China relations, the typical actions and public policies of the U.S. S&T strategy against China, the article analyses the underlying logic and internal mechanism of the U.S. S&T strategy against China in the context of the chip industry. The study finds that the underlying logic of the U.S. S&T strategy against China is dominated by the “small yard and high fence”, embedded in the “combination punch mechanism” combining “run fast” and “keep away”. The study provides theoretical and practical implications on international S&T relations and innovation policy.

摘要： 随着中国近年来科技创新竞争力的快速发展，美国展开对中国在芯片、5G、超算等高科技领域的打压与封锁。已有研究缺少关于美对华科技战略形成背景以及行动机制等的系统解析。本文基于科技领域中美关系的大事件、美国对华科技战略的典型行动与公共政策等，聚焦芯片产业解析了美对华科技战略的底层逻辑与内在机制。研究发现：当前美国推进以“小院高墙”为主导的对华科技战略，其实施的底层逻辑嵌入于“加速行动”与“持续排他”为基础的“组合拳机制”。研究为国际科技关系与创新政策的研究与实践提供启示。